What is the difference between via and pad in the PCB board?

The via in the printed circuit board can be divided as through hole, blind hole and buried hole. It is mainly used for the connection of wires of different layers in the same network, and is generally not used as a soldering component.

The pad in the PCB board can be divided as a pin pad and a surface pad. The pin pad has a solder hole, which is mainly used for soldering the pin component. The surface pad has no solder hole, and is mainly used for soldering. Surface mount component.

Via mainly plays the role of electrical connection. The aperture of via is generally small. Usually, as long as the plate processing technology can be done, the via surface can be coated with solder resist ink or not.

The pad not only functions as electrical. The role of the connection, but also the role of mechanical fixation, the aperture of the pad (of course, the pin pad) must be large enough to pass through the component's pins, otherwise it will cause production problems; in addition, the pad surface must not have Solder mask ink, because this will affect the soldering, and generally also apply flux on the surface of the pad when making the board; and the aperture of the pad (when referring to the pin pad) must also meet the disc diameter and the aperture The standard, otherwise it will not only affect the welding, but also lead to the installation is not strong.

Kindly please feel free to contact Kola@sdy-pcb.com or our engineer if you want more information on the difference between via and pad in the PCB boards.