PCB manufacturer's basic technical requirements for copper plating

1. Have good mechanical properties

   The mechanical properties of the plating layer of the PCB factory are mainly toughness, which is the concept of metallography. In metallography, it is determined by the relative elongation and the degree of tensile strength. The toughness specified by metallology Tou, Tou = ε * 6, where ε - relative elongation, 6 - tensile strength. The relative elongation ε=L-L0/L0*100% represents the physical quantity of the metal deformation ability, and the tensile strength is the tensile force per unit cross-section, and is the physical quantity of the deformation resistance, and the toughness is the combination of the above two The indicator of the physical quantity, indicating the total energy required to break the material. Generally, the relative elongation is not less than 10%, and the tensile strength is 20-50kg/mm2, so as to ensure that the PCB hot air is leveled or after the electric installation, the wave soldering does not cause the Z-direction fracture of the copper plating layer due to the difference in the expansion coefficient between the epoxy resin substrate and the copper plating layer.

2. The ratio of the thickness of the copper plating layer (Ts) to the thickness of the copper plating layer (Th) is close to 1:1.

   Through practical application, only the thickness of the plating on the board surface and the hole is uniform, can ensure sufficient strength and conductivity. This requires the plating solution to be used with good dispersing ability. Otherwise, the plating thickness of the hole wall must reach the national standard, and the plating time must be lengthened. The result is not only a waste of time and raw materials, but also directly affects the subsequent imaging accuracy.

3. The coating is firmly bonded to the substrate. If it is not strong, the coating will foam and peel off to a certain extent. In severe cases, the PCB will be scrapped.

4. The coating should have good electrical conductivity, because the circuit board mainly relies on the electroplated copper layer to conduct electricity. To have good conductivity, the purity of the coating is high, and the impurities are less. The impurities are mainly derived from the additives in the plating solution. Some components and impurities in the anode.

5. The copper plating layer should be uniform, detailed and have a good appearance.

Kindly please feel free to contact Kola@sdy-pcb.com or our engineer if you want more information on the PCB manufacturer's basic technical requirements for copper plating.