Circuit Board Testing Methods for Rigid PCBs

Although applying circuit board testing methods to your PCB is a constant requirement for all designs, the specific testing methods used by your contract manufacturer (CM) may vary a great deal. Therefore, you should be aware of the circuit board testing methods employed by your CM, as they are an important aspect of the PCB manufacturing process and directly impact the time and cost of your PCB development.

The most common method to check PCB construction quality is visual inspection, which is typically performed throughout the PCB manufacturing process. This type of inspection is critical as it supports some automatic fabrication and assembly steps. However, detailed testing and sophisticated equipment are required to provide high-level QA. Below is a list of QA tests and the information they yield about your board:

Peel Test – used to determine the amount of strength required to peel laminate from board.

Solder Pot Test – determines the solderability of plated through hole (PTHs).

Solder Float Test – measures the degree of thermal stress that a PCB hole can withstand.

X-ray Inspection – used to view the PCB’s internal construction; including layers and vias. Can also be used to view inside of component packages to verify device types and authenticity.

Automated Optical Inspection AOI – performed to check solder quality and verify pad and trace connections. Time Domain Reflectometry (TDR) – typically done to measure characteristic impedances. Can determine if differential traces are matched for good signal integrity.

Resistivity of Solvent Extract (ROSE) Testing – highly reliable test used to ensure that your board does not contain significant surface debris remaining from manufacturing processes or excess conductive material.

If you want more information on circuit board testing methods and how to prepare your PCB to be tested during manufacturing, contact us.