Multilayer PCB Layer Stackup
Modern electronics has been increasingly pushing PCBs towards small size, light weight, and high speed. The only way to increase the tracks within a certain area is to increase the track layers, so that the tracks would not be crossed. Combined by a type of semi-solid adhesive which is called "prepreg", two or more single and/or double-sided PCBs are stacked together to generate multilayer PCBs through reliable predefined mutual connection between them. There are three or more conductive layers in one multilayer PCB with two layers outside and one layer synthesized in the insulation board. With the increase of PCB complexities and densities, it's possible for some issues to take place such as noise, stray capacitance and cross talk when layer arrangement gets inefficient design.
Stackup refers to the arrangement of copper layers and insulating layers that make up a PCB prior to board layout design. While a layer stack-up allows you to get more circuitry on a single board through the various PCB board layers, the structure of PCB stack-up design confers many other advantages:
- A PCB layer stack can help you minimize your circuit's vulnerability to external noise as well as minimize radiation and reduce impedance and crosstalk concerns on high-speed PCB layouts.
- A good layer PCB stack-up can also help you balance your need for low-cost, efficient manufacturing methods with concerns about signal integrity issues
- The right PCB layer stack can enhance the Electromagnetic Compatibility of your design as well.
Usually SDY manufactures the multilayer PCBs according to standard layer stackup with minimum cost, if there are no special requirements on layer stackup from customers. Or SDY proposes layer stackup to customers for approval. Kindly please feel free to contact our engineers or Alex@sdy-pcb.com for any layer stackup information.